Physics 3330: Electronics for the Physical Sciences
Instructors: Heather Lewandowski, Kevin Stenson, James Thompson
This is the silicon chip inside of the National Semiconductor LMV301 op-amp. The five white squares are bonding pads for attaching 20 micron diameter gold wires to connect the chip to the lead-frame of the package. The LMV301 is designed for low-voltage battery-operated systems and is available in a tiny 2x1x1 mm package. The chips are made on 6-inch diameter silicon wafers in a complex process that requires 18 lithographic masking operations.
Labs 3 and 4 cover passive filters and basic op-amp circuits.
Important: Please note the schedule of assignments for the first few weeks.
Prelabs are due at 5pm the day before the lab
We also have a little reminder about writing lab reports
Home page from weeks 1-2.
I welcome your comments on the class and this website. Send them to Kevin Stenson